
Up to 16,384 channels of fast, accurate and intelligent open/short testing for maximum efficiency and quality in semiconductor packaging.
Compared with conventional open/short test equipment, iOST is designed to be faster, more accurate and smarter to use — delivering the highest efficiency and quality in semiconductor package testing.
High pin count
Up to 16,384 channels. Thanks to a real-time multiplexing design, even a 16,384-channel system has 50% lower latency than the previous 2,048-channel generation. Each chassis supports up to 2,048 channels (16 CH boards × 128 channels), and LB cables remain fully compatible with the previous system.
High performance
- High precision — every circuit uses new-generation industrial-grade components (OPA, PGA, ADC, DAC…) for better accuracy, higher speed and lower temperature drift.
- High reliability — built-in precision voltage references and smart self-calibration circuitry. A low-power design with fully isolated measurement units keeps data stable even in noisy environments, and one-key self-calibration replaces tedious manual calibration so testing is always correct.
- High speed — iOST keeps the traditional instrument command interface but adds an on-board test program processor that runs all measurements autonomously while the PC analyses results in parallel. Dedicated real-time channel switching keeps signal delay minimal, so even 16,384 channels have very limited impact on OST test time.

Intelligent features
- Auto-learning — simple parameter setup and enhanced algorithms produce more accurate analysis and more complete test conditions, so production can start immediately. Existing test programs remain compatible. Per-channel voltage, current and impedance statistics, together with I-V and V-T curve analysis, help engineers validate and debug test programs faster.
- Full self-diagnostics — the HP16 series includes a dedicated Diag-Board with high-precision, low-drift circuitry for accurate DUT simulation and standard load testing, plus APMU force/measure verification, LB cable impedance checks, CH board leakage checks and diode curve tests to resolve issues quickly during mass production.
- Precision self-calibration — stable references and smart calibration with no trimmer adjustment reduce the effects of temperature, humidity and vibration. The RWC (Read-Write-Click) procedure is simple: connect a certified precision DMM, read the voltage, write it into the software console and click Calibrate — done automatically within 10 seconds.
- Yield analysis — use the built-in V / I / R tools for static per-channel testing, or dynamic I-V and V-T curves for failure analysis. Yield and fault statistics are presented as tables and charts so process issues surface quickly.

Specifications
| System Performance | PC Interface | 1-Port USB | ||
| Max. Pin-Count | 16384 (128CH~16384CH) | |||
| Test Time (8192-pin System) | 0.4mS Per Pin Typically (Test Current = 100uA, CV = 3.0V) | |||
| A/D, D/A Resolution | 16-bit | |||
| Handler Interface | 1. Support Maximum 16-Site HIF (*1) 2. SOT, EOT, BIN1/BIN2/BIN3, RET Handshaking (*2) 3. TTL/CMOS, 3.3~15V, with Optical Isolator | |||
| Operation | 1. 4-quadrant operation: Pin-to-Pin, Pin-to-All, All-to-Pin 2. Force Current Measure Voltage (FIMV), with Voltage Clamping 3. Force Voltage Measure Current (FVMI), with Current Clamping 4. Leakage Current Measurement 5. I-V Curve and V-T Curve analysis 6. Kelvin 4-wire Architecture | |||
| APMU Resolution Accuracy (*3) | Force Voltage | ±10.0V | 0.313mV | ± 0.3% |
| Force Current | ± 10.0uA | 0.156nA | ± 0.4% | |
| ± 0.1mA | 1.562nA | ± 0.2% | ||
| ± 1.0mA | 15.62nA | ± 0.2% | ||
| ± 10.0mA | 156.2nA | ± 0.2% | ||
| Measure Voltage | ± 1.0V | 0.032mV | ± 0.1% ± 1.0mV | |
| ± 2.0V | 0.063mV | ± 0.1% ± 1.0mV | ||
| ± 4.0V | 0.125mV | ± 0.1% ± 2.0mV | ||
| ± 8.0V | 0.250mV | ± 0.1% ± 4.0mV | ||
| Measure Current | ± 10.0uA | 0.313nA | ± 0.2% ± 0.01uA | |
| ± 100.0uA | 3.125nA | ± 0.1% ± 0.10uA | ||
| ± 1.0mA | 31.25nA | ± 0.1% ± 1.00uA | ||
| ± 10.0mA | 312.5nA | ± 0.1% ± 10.0uA | ||
| Measure Leakage (*4) | 10~200nA | 0.078nA | ± 1.0% ± 0.5nA | |
| 0.2-3.0uA | 0.156nA | ± 0.5% ± 5.0nA | ||
| Software Application | OS | Windows XP/XP Pro, Windows 7/8/10 or higher version | ||
| Operation | 1. Production/Engineer mode controlled by Password 2. Smart Program Auto-Learning/Program Editor 3. Real-Time Production Status Monitoring 4. Manual Pin-Testing/Analysis, Production Statistics Logger/Analysis 5. One-Key Self-Calibration/Fully Self-Diagnostics | |||
| File I/O | 1. Text Engineering Statistics file 2. Text Production Logger/Fault Analysis file 3. Text Wire definition/Test Program file 4. Text System Configuration file | |||
| *1: Standard equipped 2-Site/8-Site HIF. 16-Site HIF is optional, TBD *2: RET function of HIF is optional, TBD *3: Accuracy ± (% of Display ± Offset), 1 Year, 23℃ ± 5℃ *4: Guaranteed by parametric design, not subject to production test | ||||



