FDC data upload
Capture key equipment parameters and upload to FDC in real time.

Two decades in semiconductor packaging and test — from equipment data upload and machine automation retrofits to process monitoring that lifts yield and uptime.
Capture key equipment parameters and upload to FDC in real time.
Add SECS/GEM communication to existing tools for factory automation.
Add automation modules to legacy machines and bring them under CIM.
Timed discharge control and flow monitoring with FDC upload.
Temperature, humidity, airflow and other key parameters for factories, warehouses and data centres, with analytics that cut energy use and carbon.
Real-time vibration, temperature rise and current measurement, with predictive-maintenance analytics that extend equipment life.
Precise optical analysis for light sources and vision systems to improve product quality, work environments and energy-efficient lighting.
High-precision cameras with AI analysis for face and vehicle recognition and abnormal-behaviour detection, reducing workplace risk.
Complete energy usage measurement and optimisation, with smart reports that help build ESG-compliant energy-saving plans.
Hardware, software and data platforms developed to your requirements, with compliance and transparency built in.
Smart monitoring and analytics help reduce energy consumption and emissions for a more sustainable operation.
Safer workplaces, with protection of people and assets considered from the design stage.
Accurate records support compliance and transparent decision-making for long-term stability.

Up to 16,384 channels of fast, accurate and intelligent open/short testing for maximum efficiency and quality in semiconductor packaging.

24/7 automatic measurement of equipment grounding resistance with instant alarms and full history, so ESD protection actually works on the line.

A smart storage rack with AGV handling, MES integration and RFID tracking for high-density, unmanned FOUP storage.
Tell us what you need — our engineers will get back to you with a quote and lead time.